Thermosonic Wirebond Process Engineer - Yield & Quality

Onsemi is seeking a Wire Bond Process Engineer to own and optimize the thermosonic wire bond process. The ideal candidate will have over 10 years of experience in semiconductor manufacturing, with at least 5 years focusing on wire bond processes. Responsibilities include optimizing wire bonding parameters, troubleshooting bond issues, and ensuring process compliance. Beneficial skills include using K&S or ASM platforms. Work location is in Lapu-Lapu City, Philippines.
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