Technician 2, Manufacturing Equipment (Die Prep)

Sandisk · Simpang Ampat, Penang, Malaysia

Location
Simpang Ampat
Job Type
full-time
Posted
July 04, 2026

Job Description

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Be responsible for Die Prep equipment day to day line sustaining, PM and conversion.
  • Able to hands on and provide systematic problem analysis.
  • Ability to troubleshoot, analyze complex problems and 5 WHY analysis.
  • Be available for overtime work as of when needed.
  • Experience in PM and major down troubleshooting.
  • Responsible to liaise with process engineering team for low yield triggering.

Qualifications

REQUIRED:

  • Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent.
  • 1~3 years of equipment engineering experience in Wafer soft test equipment maintenance.

PREFERRED:

  • Knowledge in Backgrind, wafer saw and Taping will be added advantage.
  • Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project.

SKILLS:

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