Sr Mgr, Bump/DPS & Assembly Engineering

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit
to learn how our innovative team is helping connect, protect and power our planet. Responsibilities / Accountabilities Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification. Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a t...