Senior Wafer Bumping & Fan-Out Process Engineer

Lumilens in Penang, Malaysia is seeking an experienced engineer to lead process development for wafer bumping and Fan-Out processes in silicon photonic chip manufacturing. The ideal candidate will have over 5 years of relevant experience and a strong technical background in materials science or engineering disciplines.

The role involves managing process paths, evaluating new materials, and compiling necessary documentation to support new product introductions. Strong proficiency in photolithography processes and analytical software tools is a must.