Senior Packaging Engineer — IC/Power Systems

A leading semiconductor company located in Malaysia seeks an experienced engineer to drive technical package definition for innovative projects. Ideal candidates will have a Bachelor's Degree in Engineering and at least 9 years in the IC/semiconductor industry, with expertise in packaging technologies and AutoCAD. This role involves generating package outlines, coordinating cost estimations, and scouting for new technologies. Join a forward-thinking team that promotes diversity and innovation.
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