Senior Failure Analysis Engineer – Packaging & Device

Sandisk in Batu Kawan, Malaysia, is seeking qualified candidates for a position focused on package and device analysis. The role involves conducting failure analysis on assembly test defects and maintaining compliance in a lab setting.

Applicants must have a Master’s or Bachelor’s Degree in Electrical & Electronic or Material Engineering, along with strong memory IC de-processing skills. Fluency in English and strong teamwork abilities are essential. Sandisk promotes diversity and inclusion in its workplace.