Principal Engineer, FE OCT CPEE ADT BOND

As a Bonding Process & Equipment Engineer at Micron Technology, you will join the Micron Central team under ADT and be responsible for the startup, development, optimization, and control of wafer-level bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive yield improvement, cost reduction, process capability enhancement, and risk management while resolving complex manufacturing challenges across process integration, equipment engineering, suppliers, and global manufacturing sites.

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)
• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
• Drive process capability improvement (Cpk) and defect reduction

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