Packaging Module Development Engineer – NPI & Assembly Expert

Intel Corporation is seeking a Package Module Development Engineer located in Kulim, Kedah, Malaysia. In this role, you will define and establish process flow, conduct FMEA assessments, and develop solutions for various challenges during the development cycle.

The ideal candidate will have a Bachelor or Master’s degree, and 3+ years in process development within the semiconductor field. Experience with statistical design techniques and data sciences will be beneficial.

This position requires on-site presence to ensure effective support in new factory start-ups and material development processes.