Optical Packaging Process Architect Ottawa

Lead innovation in optical solutions with a leading tech firm in Ottawa. Seeking an expert in flip-chip and wire bonding processes for next-generation technologies.

We are looking for a Senior Optical Packaging and Flip Chip Process Architect with a Master’s degree and over eight years of relevant experience. This role emphasizes your ability to define assembly strategies and enhance process recipes while providing mentorship to junior engineers. Join a team focused on cutting-edge advancements in microelectronics.

Key Responsibilities:
• Define assembly strategies for optical packages
• Develop critical process recipes for new technologies
• Mentor and guide junior engineers in their development
• Collaborate on next-generation optical solutions
• Innovate in flip-chip and wire bonding processes

Requirements:
• Master’s degree in engineering or related field
• Minimum of 8 years of experience in a relevan...