Lead Die-Bond Process Development Engineer

Infineon Technologies is seeking a skilled Process Development Engineer in Malacca to lead process development activities focusing on die bonding. The role involves technical support, documentation, and supplier collaboration. Candidates should have a Bachelor's Degree in Engineering and 5 years of relevant experience. Proficiency with die bonder platforms and statistical analysis software is highly advantageous. A commitment to teamwork, creativity, and a focus on excellence is essential in this diverse and inclusive environment.
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