Location
Bengaluru
Job Type
Full-time
Posted
May 27, 2026
Job Description
Walk-In Drive: IC Package Design Engineer (3+ Years)
Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)
HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!
Interview Details
Date: 16 May 2026 (Saturday)
Time: 9:00 AM – 2:00 PM
Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
Mode: Face-to-Face (F2 F)
SPOC: Mareeswari C M
Role: IC Package Design Engineer
Experience: 3+ Years
Key Responsibilities & Required Skills
Strong experience in IC Package / Substrate Design (mandatory)
Hands-on experience with Cadence APD (Allegro Package Designer)
Good understanding of package/substrate design and assembly rules , especially for flip chip designs
Exposure to various package technologies such as MCM, Flip-Chip, Wire Bond, 2.5 D, 3 D (added advantage)
Expertise in high-speed complex package & PCB de...
Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)
HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!
Interview Details
Date: 16 May 2026 (Saturday)
Time: 9:00 AM – 2:00 PM
Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
Mode: Face-to-Face (F2 F)
SPOC: Mareeswari C M
Role: IC Package Design Engineer
Experience: 3+ Years
Key Responsibilities & Required Skills
Strong experience in IC Package / Substrate Design (mandatory)
Hands-on experience with Cadence APD (Allegro Package Designer)
Good understanding of package/substrate design and assembly rules , especially for flip chip designs
Exposure to various package technologies such as MCM, Flip-Chip, Wire Bond, 2.5 D, 3 D (added advantage)
Expertise in high-speed complex package & PCB de...