HBM Package Product Engineer - Yield & Innovation

1100 Micron SemiAsiaOP Pte Ltd is looking for a Product Engineer in Singapore to enhance package and HBM product engineering activities. This role involves improving yield through collaboration across teams and driving innovation for competitive advantage.

The ideal candidate holds a Bachelor’s or Master’s degree in Engineering with over 3 years of experience in the semiconductor industry. You will be responsible for project management and AI/ML advocacy, ensuring efficient execution and leading technical development.