Flip Chip Packaging Intern: Data-Driven Process Optimization

Dormont Manufacturing Co is seeking an intern for their Assembly Process Engineering team in Singapore. This role offers hands-on experience with advanced semiconductor packaging, focusing on Flip Chip Attach and Underfill technologies.

The ideal candidate will engage in process development, analysis, and the application of statistical methods and AI programming to optimize processes and enhance yield.

A strong foundation in engineering is required, with internship availability from January to May 2026.