Etch Packaging R&D Process Engineer (Semiconductors)

Applied Materials, Inc. in Singapore is looking for an R&D Process Engineer (Etch Packaging) to enhance the semiconductor manufacturing processes. Candidates must have a degree in Materials Science, Chemical Engineering, Chemistry, or Physics, with at least 2 years of relevant experience, particularly in Plasma Etch process development. The role entails designing and optimizing processes, data analysis, and customer interactions. Applied Materials offers a supportive culture that promotes career growth and employee wellbeing.
#J-18808-Ljbffr