Engineer II (Die Attach/Die Bond/Wire Bond)

# Engineer II (Die Attach/Die Bond/Wire Bond)Onsite |Mid Level|Full TimePosted: Today#### Company LocationSeremban, Malaysia#### Remote Work PolicyOnsite#### SkillsSOLIDPower BI**Job Description****About the role** This role is responsible for end-to-end ownership of both process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel (R2R) semiconductor assembly line. The engineer plays a critical role in ensuring high equipment uptime, process stability, yield improvement, and quality excellence in a high-volume manufacturing environment.The position requires strong technical hands-on capability, data-driven problem solving, and close collaboration with cross-functional teams. The engineer will act as a key technical owner, driving continuous improvement, supporting new product introductions, and implementing robust controls to prevent process and equipment-related failures.**What You Will Do*** Own and sustain Die Attach and Wire Bond processes and equipment...