Electroplating & Wet Process Engineer - Yield & Quality

UTAC in Singapore is seeking a technical professional to develop and optimize electroplating processes. Key responsibilities include monitoring plating performance, leading troubleshooting efforts, and collaborating with cross-functional teams for quality improvement.

The ideal candidate holds a degree in Chemical Engineering or related fields, with preferred experience in semiconductor packaging and knowledge of plating chemistry. This role requires strong analytical skills and the ability to work in a cleanroom environment.