Die Attach & TCB Process Engineer for High-Volume ICs

Intel is seeking an experienced hire for a position in Kulim, Malaysia. The role focuses on owning high-volume manufacturing processes and equipment critical for device miniaturization and semiconductor production. Candidates should have at least 2 years of hands-on experience with relevant processes and a Bachelor’s degree in Materials, Mechanical, Chemical, or Electrical Engineering. The position requires working within Class 10k-100k cleanrooms and encompasses responsibilities like process optimization and technology transfer.
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