CoW Development Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD. · singapore, singapore, Singapore

Location

singapore

Job Type

Full-time

Posted

June 14, 2026

Job Description

            Purpose of the Job  To support R&D activities for 2.5D wafer-level packaging (WLP) processes—including Die Preparation, Chip Attach, and Mold—focusing on process reliability, manufacturability, and integration for advanced semiconductor packages. 
 Key Job Accountabilities  Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving, dicing saw
Chip Attach: TCB (Thermo-Compression Bonding), LCB (Laser Compression Bonding)
Mold: compression or transfer mold for warpage and protection 
Perform material evaluation and reliability analysis (e.g., XRF, shear test) 
Conduct DOE/FMEA for robust process design and improvement 
Work closely with cross-functional teams (e.g., Bumping, RDL, Failure Analysis) to enable seamless process integration 
Track and analyze industry trends in equipment, materials, and technologies 
Support new product introduction (NPI) ...
        

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