Location
lapu lapu
Job Type
Full-time
Posted
June 19, 2026
Job Description
Job Description
Hands‑on technician role performing board‑level diagnostics, rework, repair, and verification on PCBs, load boards, interface cards, and modules supporting semiconductor test and manufacturing. Scope includes fault isolation, component‑level replacement (SMD/BGA/QFN/through‑hole), micro‑soldering, reflow profiling, X‑ray verification, and conformal coating/cleaning. Partners with Test Engineering, FA/Quality, and Production to restore functionality quickly and prevent repeats.
Responsibilities
- Triage incoming boards; document failure symptoms, history, and disposition in CMMS/repair tracker.
- Perform component‑level fault isolation using schematics, netlists, continuity, and signal tracing.
- Execute soldering/rework: BGA, QFN, LGA, fine‑pitch, through‑hole; micro‑soldering under microscope.
- Set & verify reflow profiles; manage BGA reballing; validate with X‑ray/AOI as needed.
- Use DMM, oscillos...