Location
singapore
Job Type
Full-time
Posted
June 17, 2026
Job Description
Responsibilities
- Drive and manage silicon Bump & package assembly suppliers, backend processes and solutions to achieve aggressive TQRDCEB goals.
- Work closely with package design & technology, test & product engineering, production planning, quality engineering & NPI teams, and assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, managing process improvements and changes.
- Provide day‑to‑day support to bump and assembly suppliers and internal planning, product and test engineering teams.
- Plan, drive and implement improvement activities for continual improvement, second sourcing, cost reduction and customer satisfaction.
- PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7‑12 years of relevant experience managing advanced node silicon bumping, large body single and multi‑chip (2.1/2.5/3D) package ass...
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