Location
Hsinchu
Job Type
Full-time
Posted
July 04, 2026
Job Description
Serve as a technical expert for advanced packaging technologies, 2.5D/3D with RDL CoW processes, large body packaging design, assembly and integration. Work directly with key suppliers to develop and enable new processes, module and material for areas of package design, assembly, integration and substrate manufacturing.
+ Engage with leading assembly suppliers to understand assembly process, module design rules and requirements.
+ Define assembly process integration and flow for advanced multiple die heterogeneous integration
+ Develop comprehensive plans of assembly and reliability to evaluate and qualify new package technologies.
+ Work closely with substrate suppliers to evaluate new materials & design rules for package warpage, stress, and SI/PI performance optimization to enable and advance product substrate physical design and implementation.
+ Work with internal package physical design team to resolve design challenges and implement working solutions using D...
+ Engage with leading assembly suppliers to understand assembly process, module design rules and requirements.
+ Define assembly process integration and flow for advanced multiple die heterogeneous integration
+ Develop comprehensive plans of assembly and reliability to evaluate and qualify new package technologies.
+ Work closely with substrate suppliers to evaluate new materials & design rules for package warpage, stress, and SI/PI performance optimization to enable and advance product substrate physical design and implementation.
+ Work with internal package physical design team to resolve design challenges and implement working solutions using D...