Location
Broomfield
Job Type
Full-time
Posted
July 18, 2026
Job Description
Job Title: IC Package Design Manager – ASIC Engineer
Job Description
This role leads a team of engineers designing complex flip‑chip BGA packages for advanced ASICs that power artificial intelligence, networking, high‑performance computing, and 5G base stations. You will manage and mentor a worldwide R&D team, drive high‑performance package designs featuring cutting‑edge SerDes, high‑bandwidth memory, and advanced power delivery, and shape technical methodologies and project management practices for multiple concurrent programs.
Responsibilities
+ Lead and manage a team of IC package design engineers focused on complex flip‑chip BGA packages for industry‑leading ASICs.
+ Oversee and contribute to the design of packages that support high‑speed SerDes (448G and higher), 5G RF/microwave ADC/DAC, HBM, DDR5, and very high power delivery requirements.
+ Create, maintain, and track project plans for 20+ concurrent package designs, including defining scope, ...
Job Description
This role leads a team of engineers designing complex flip‑chip BGA packages for advanced ASICs that power artificial intelligence, networking, high‑performance computing, and 5G base stations. You will manage and mentor a worldwide R&D team, drive high‑performance package designs featuring cutting‑edge SerDes, high‑bandwidth memory, and advanced power delivery, and shape technical methodologies and project management practices for multiple concurrent programs.
Responsibilities
+ Lead and manage a team of IC package design engineers focused on complex flip‑chip BGA packages for industry‑leading ASICs.
+ Oversee and contribute to the design of packages that support high‑speed SerDes (448G and higher), 5G RF/microwave ADC/DAC, HBM, DDR5, and very high power delivery requirements.
+ Create, maintain, and track project plans for 20+ concurrent package designs, including defining scope, ...