Job Description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
職務說明Micron currently has an opening for HBM package integration engineer in the Advanced Packaging Technology Development (APTD) organization located in Taichung. As a HBM package integration engineer you will be part of the PI group responsible for driving development and introduction of new process solutions to the HBM (high bandwidth memory )that will be implemented in advanced stacked DRAM memory products. And subsequent improvement in for electric yield and product reliability including C3D/C4D/ AQLK analysis to drive and help process engineer to prepare for its transfer to manufacturing.
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