AI/ML-Driven FEA Intern: Explore & Evaluate Simulation Tools

Infineon Technologies AG is offering an internship position in Singapore as part of the package simulation team. The student will engage in finite element analysis using Ansys and LS-DYNA, leveraging AI/ML-based approaches to evaluate different models.

The ideal candidate is enrolled in a Master’s program in Mechanical Engineering or a related field, with hands-on experience in Ansys, LS-Dyna, Python, and Visual Basic. The role provides insights into package development and AI/ML integration.